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Mobile Phone BGA IC Chip Repair Blades Kit for iPhone A8 A9 A10 A11 CPU Remover Logic Board NAND Flash Repair Tools

Mobile Phone BGA IC Chip Repair Blades Kit for iPhone A8 A9 A10 A11 CPU Remover Logic Board NAND Flash Repair Tools
Item Code: TOPA1806012C
Market Price:
USD $16.68
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Save $2.23(13% Off)
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  • Description

Mobile Phone BGA IC Chip Repair Blades Kit for iPhone A8 A9 A10 A11 CPU Remover Logic Board NAND Flash Repair Tools


Feature:
blade ultra-thin,high toughness, high temperature, no deformation, no sticky tin, you can quickly separate the tin point.

Applicable to repair the Apple motherboard tool demolition CPU dismantling chip
1. The thickness of the blade is thinner than that of the tin, so it can work well between the chip and the bottom of the plate.
2: demolition of a variety of small chips will not drop points
3: split 6S power IC various glass IC, do not hurt the glass, will not drop, no risk
4: split base with CPU WIFI module, no risk will not drop points
5: Remove the A4-A9 CPU without risk, demolition of all the upper CPU is no risk
6: thicker scraper, scraping the CPU once, no need to repeat the scraping






If you need more questions, pls feel free to contact me as below:

Crystal Fan
Skype: touchtimes    
Phone: 86-755-8457 1950 
Wechat/ WhatsApp/ Mobile: +86 13502810010

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